Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163853 | Formation method of chip package | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Shang-Yun Hou, Wei-Ming Chen | 2018-12-25 |
| 10163856 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Shang-Yun Hou, Wen-Hsin Wei | 2018-12-25 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2018-12-11 |
| 10090213 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2018-10-02 |
| 10014252 | Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors | Shih-Cheng Chang, Liang-Chen Lin, Fu-Tsai Hou, Tung-Chin Yeh, Shih-Kai Lin +2 more | 2018-07-03 |
| 9978637 | Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) | Tzuan-Horng Liu, Shih-Wen Huang, Chung-Yu Lu, Shang-Yun Hou, Shin-Puu Jeng | 2018-05-22 |