Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090213 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2018-10-02 |
| 9978637 | Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) | Shih-Wen Huang, Chung-Yu Lu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng | 2018-05-22 |