Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163853 | Formation method of chip package | Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2018-12-25 |
| 10163856 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou | 2018-12-25 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2018-12-11 |