Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2018-12-18 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou +2 more | 2018-12-11 |
| 10090253 | Semiconductor package | Jing-Cheng Lin, Po-Hao Tsai, Szu-Wei Lu | 2018-10-02 |
| 10049928 | Embedded 3D interposer structure | Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2018-08-14 |
| 10032662 | Packaged semiconductor devices and packaging methods thereof | Shu-Hang Liao, Szu-Wei Lu, Jing-Cheng Lin | 2018-07-24 |
| 9929109 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2018-03-27 |
| 9895871 | De-bonding and cleaning process and system | Jing-Cheng Lin, Szu-Wei Lu | 2018-02-20 |