Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157850 | Semiconductor packages and manufacturing method thereof | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10115650 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Szu-Wei Lu, Jing-Cheng Lin | 2018-10-30 |
| 10008218 | Blind bandwidth extension using K-means and a support vector machine | Mark S. Vinton | 2018-06-26 |
| 9987734 | Flat clinch anvil assembly | Joel S. Marks | 2018-06-05 |
| 9929109 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin | 2018-03-27 |