Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163876 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Jui-Pin Hung | 2018-12-25 |
| 10163860 | Semiconductor package structure | Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng | 2018-12-25 |
| 10083946 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin | 2018-09-25 |
| 10050024 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Shuo-Mao Chen, Shin-Puu Jeng | 2018-08-14 |
| 10020275 | Semiconductive packaging device and manufacturing method thereof | Jing-Cheng Lin | 2018-07-10 |
| 9997471 | Semiconductor package structure and manufacturing method thereof | Jui-Pin Hung, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2018-06-12 |
| 9985006 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Jui-Pin Hung | 2018-05-29 |
| 9947629 | Method of forming contact holes in a fan out package | Szu-Wei Lu, Jing-Cheng Lin | 2018-04-17 |
| 9935080 | Three-layer Package-on-Package structure and method forming same | Jui-Pin Hung, Shin-Puu Jeng | 2018-04-03 |
| 9911629 | Integrated passive device package and methods of forming same | Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng | 2018-03-06 |