Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163860 | Semiconductor package structure | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2018-12-25 |
| 10050024 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng | 2018-08-14 |
| 9997471 | Semiconductor package structure and manufacturing method thereof | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng, De-Dui Liao | 2018-06-12 |
| 9960106 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2018-05-01 |
| 9922903 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2018-03-20 |
| 9922160 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2018-03-20 |
| 9911629 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2018-03-06 |