Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153205 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Der-Chyang Yeh | 2018-12-11 |
| 10084061 | Polysilicon design for replacement gate technology | Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more | 2018-09-25 |
| 9960106 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Der-Chyang Yeh | 2018-05-01 |
| 9929251 | Polysilicon design for replacement gate technology | Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more | 2018-03-27 |
| 9922903 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2018-03-20 |