Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083949 | Using metal-containing layer to reduce carrier shock in package formation | Shin-Puu Jeng, Hsien-Wen Liu | 2018-09-25 |
| 10025092 | Projector and projecting lens thereof | Hsin-Ying Wu | 2018-07-17 |
| 9922903 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2018-03-20 |