Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163706 | Alignment marks in substrate having through-substrate via (TSV) | Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2018-12-25 |
| 9941159 | Method of manufacturing a semiconductor device | Jian-Hong Lin, Shiou-Fan Chen, Chwei-Ching Chiu, Yung-Huei Lee | 2018-04-10 |