Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163706 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2018-12-25 |
| 9997497 | Through silicon via structure | Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Chen-Yu Tsai | 2018-06-12 |