Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2018-12-25 |
| 10163875 | Method for forming chip package structure with adhesive layer | Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin | 2018-12-25 |
| 9929128 | Chip package structure with adhesive layer | Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin | 2018-03-27 |