Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2018-12-25 |
TT
Tsan-Hua Tung
Overall (2018): #205,016 of 503,207Top 45%
1
Patents 2018