Issued Patents 2018
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115675 | Packaged semiconductor device and method of fabricating a packaged semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2018-10-30 |
| 10115653 | Thermal dissipation through seal rings in 3DIC structure | — | 2018-10-30 |
| 10115647 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jy-Jie Gau | 2018-10-30 |
| 10109573 | Packaged semiconductor devices and packaging devices and methods | Po-Hao Tsai | 2018-10-23 |
| 10109613 | 3DIC stacking device and method of manufacture | Chen-Hua Yu | 2018-10-23 |
| 10109567 | Fan-out wafer level package structure | — | 2018-10-23 |
| 10103132 | Semiconductor device and method of manufactures | Po-Hao Tsai, Li-Hui Cheng | 2018-10-16 |
| 10103125 | Chip package structure and method for forming the same | Chen-Hua Yu, Po-Hao Tsai, An-Jhih Su | 2018-10-16 |
| 10090253 | Semiconductor package | Po-Hao Tsai, Ying-Ching Shih, Szu-Wei Lu | 2018-10-02 |
| 10083946 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung | 2018-09-25 |
| 10083928 | Metal bump joint structure | — | 2018-09-25 |
| 10083913 | Fan-out POP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Nai-Wei Liu, Tsei-Chung Fu | 2018-09-25 |
| 10079225 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jui-Pin Hung, Li-Hui Cheng | 2018-09-18 |
| 10079159 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jui-Pin Hung, Li-Hui Cheng | 2018-09-18 |
| 10062662 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung | 2018-08-28 |
| 10049928 | Embedded 3D interposer structure | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2018-08-14 |
| 10049989 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2018-08-14 |
| 10032662 | Packaged semiconductor devices and packaging methods thereof | Shu-Hang Liao, Ying-Ching Shih, Szu-Wei Lu | 2018-07-24 |
| 10020344 | CIS chips and methods for forming the same | Chen-Hua Yu, Wen-Chih Chiou | 2018-07-10 |
| 10020275 | Semiconductive packaging device and manufacturing method thereof | Feng-Cheng Hsu | 2018-07-10 |
| 10008463 | Wafer-level packaging mechanisms | Jui-Pin Hung | 2018-06-26 |
| 10008485 | Semiconductor device and method of manufacture | Po-Hao Tsai, Li-Hui Cheng, Porter Chen | 2018-06-26 |
| 9991244 | Method for forming hybrid bonding with through substrate via (TSV) | — | 2018-06-05 |
| 9978657 | Semiconductor package device and manufacturing method thereof | Nai-Wei Liu, Jui-Pin Hung | 2018-05-22 |
| 9978628 | Bonding method including adjusting surface contours of a bonding system | Yu-Liang Lin, Weng-Jin Wu | 2018-05-22 |