Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128289 | Embedded image sensor semiconductor packages and related methods | — | 2018-11-13 |
| 9997440 | Protection layer for adhesive material at wafer edge | Wen-Chih Chiou, Shau-Lin Shue | 2018-06-12 |
| 9978628 | Bonding method including adjusting surface contours of a bonding system | Yu-Liang Lin, Jing-Cheng Lin | 2018-05-22 |
| 9960197 | Molded image sensor chip scale packages and related methods | — | 2018-05-01 |