Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134701 | Solder bump for ball grid array | Cheng-Lin Huang, Jing-Cheng Lin | 2018-11-20 |
| 10115647 | Non-vertical through-via in package | Cheng-Lin Huang, Jy-Jie Gau, Jing-Cheng Lin | 2018-10-30 |