YL

Yi-Jen Lai

TSMC: 4 patents #534 of 2,904Top 20%
Overall (2018): #32,875 of 503,207Top 7%
4
Patents 2018

Issued Patents 2018

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10163843 Semiconductor device structure and manufacturing method Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng 2018-12-25
10090267 Bump structure and method for forming the same Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng 2018-10-02
9997482 Solder stud structure Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Chun-Jen Chen, Hsi-Kuei Cheng 2018-06-12
9899296 Method of forming conductive bumps for cooling device connection You-Hua Chou, Chun-Jen Chen, Perre Kao 2018-02-20