Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163843 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-12-25 |
| 10090267 | Bump structure and method for forming the same | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-10-02 |
| 9997482 | Solder stud structure | Li-Guo Lee, Yi-Chen Liu, Yung S. Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-06-12 |
| 9899296 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Chun-Jen Chen, Perre Kao | 2018-02-20 |