Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899296 | Method of forming conductive bumps for cooling device connection | You-Hua Chou, Yi-Jen Lai, Chun-Jen Chen | 2018-02-20 |
PK
Perre Kao
Overall (2018): #278,230 of 503,207Top 60%
1
Patents 2018