Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10088761 | Lithography device and apparatus and method for lithography device | Kuo-Sheng Chuang | 2018-10-02 |
| 10079174 | Composite contact plug structure and method of making same | Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang, Chia-Lin Hsu | 2018-09-18 |
| 10049925 | Metal-semiconductor contact structure with doped interlayer | Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang | 2018-08-14 |
| 9982340 | Shower head apparatus and method for controlling plasma or gas distribution | Chih-Tsung Lee, Hung Jui Chang, Shiu-Ko JangJian, Chung-En Kao, Ming-Chin Tsai +1 more | 2018-05-29 |
| 9984924 | Semiconductor device and formation thereof | Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang | 2018-05-29 |
| 9984975 | Barrier structure for copper interconnect | Yu-Hung Lin, Ching-Fu Yeh, Yu-Min Chang, Chih-Wei Chang | 2018-05-29 |
| 9976215 | Semiconductor film formation apparatus and process | Chih-Tsung Lee, Shu-Fen Wu, Chin-Hsiang Lin | 2018-05-22 |
| 9966339 | Barrier structure for copper interconnect | Yu-Hung Lin, Ching-Fu Yeh, Yu-Min Chang, Chih-Wei Chang, Sheng-Hsuan Lin | 2018-05-08 |
| 9899296 | Method of forming conductive bumps for cooling device connection | Yi-Jen Lai, Chun-Jen Chen, Perre Kao | 2018-02-20 |
| 9892954 | Wafer processing system using multi-zone chuck | Nai-Han Cheng, Chi-Ming Yang, Kuo-Sheng Chuang, Chin-Hsiang Lin | 2018-02-13 |
| 9865478 | Shielding design for metal gap fill | Ming-Chin Tsai, Bo-Hung Lin, Chung-En Kao | 2018-01-09 |
| 9859390 | Method for silicide formation | Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang, Chia-Lin Hsu | 2018-01-02 |