Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163719 | Method of forming self-alignment contact | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +3 more | 2018-12-25 |
| 10079174 | Composite contact plug structure and method of making same | Yu-Hung Lin, Chih-Wei Chang, You-Hua Chou, Chia-Lin Hsu | 2018-09-18 |
| 10049925 | Metal-semiconductor contact structure with doped interlayer | Yu-Hung Lin, Chih-Wei Chang, You-Hua Chou | 2018-08-14 |
| 10050116 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +2 more | 2018-08-14 |
| 10043885 | Bi-layer metal deposition in silicide formation | Chih-Wei Chang | 2018-08-07 |
| 9984924 | Semiconductor device and formation thereof | Yu-Hung Lin, You-Hua Chou, Chih-Wei Chang | 2018-05-29 |
| 9966339 | Barrier structure for copper interconnect | Yu-Hung Lin, Ching-Fu Yeh, Yu-Min Chang, You-Hua Chou, Chih-Wei Chang | 2018-05-08 |
| 9905670 | Bi-layer metal deposition in silicide formation | Chih-Wei Chang | 2018-02-27 |
| 9859390 | Method for silicide formation | Yu-Hung Lin, Chih-Wei Chang, You-Hua Chou, Chia-Lin Hsu | 2018-01-02 |