Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163644 | Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same | Ya-Lien Lee, Chun-Chieh Lin, Hung-Wen Su | 2018-12-25 |
| 10163719 | Method of forming self-alignment contact | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Sheng-Hsuan Lin +3 more | 2018-12-25 |
| 10050116 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Sheng-Hsuan Lin +2 more | 2018-08-14 |
| 9991125 | Method for forming semiconductor device structure | Chen-Yuan Kao, Chun-Chieh Lin, Huang-Yi Huang | 2018-06-05 |