Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163719 | Method of forming self-alignment contact | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +3 more | 2018-12-25 |
| 10163644 | Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2018-12-25 |
| 10079176 | Method of using a barrier-seed tool for forming fine pitched metal interconnects | — | 2018-09-18 |
| 10050116 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Hung-Wen Su, Ming-Hsing Tsai, Rueijer Lin +2 more | 2018-08-14 |
| 10043706 | Mitigating pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen | 2018-08-07 |
| 9941199 | Two step metallization formation | Chun-Chieh Lin | 2018-04-10 |
| 9892963 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2018-02-13 |