Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163689 | Integrated circuit with conductive line having line-ends | Jyu-Horng Shieh, Pei-Wen Huang | 2018-12-25 |
| 10157752 | Systems and methods for in SITU maintenance of a thin hardmask during an etch process | Chung-Wen Wu | 2018-12-18 |
| 10115630 | Interconnect structure and method of forming the same | Jeng-Shiou Chen | 2018-10-30 |
| 10043706 | Mitigating pattern collapse | Ya-Lien Lee, Chung-Wen Wu, Jeng-Shiou Chen | 2018-08-07 |
| 10043754 | Semiconductor device having air gap structures and method of fabricating thereof | Jyu-Horng Shieh | 2018-08-07 |
| 10002784 | Via corner engineering in trench-first dual damascene process | — | 2018-06-19 |
| 9991200 | Air gap structure and method | Jyu-Horng Shieh | 2018-06-05 |
| 9966309 | Contact plug without seam hole and methods of forming the same | Jyu-Horng Shieh | 2018-05-08 |
| 9929094 | Semiconductor device having air gap structures and method of fabricating thereof | Jyu-Horng Shieh | 2018-03-27 |
| 9892960 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Jyu-Horng Shieh, Minghsing Tsai | 2018-02-13 |