Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163689 | Integrated circuit with conductive line having line-ends | Chih-Yuan Ting, Pei-Wen Huang | 2018-12-25 |
| 10157775 | Method for manufacturing a semiconductor device | Chih-Hao Chen, Ming-Chung Liang, Shu-Huei Suen, Wen-Yen Chen | 2018-12-18 |
| 10109497 | Double patterning method | Chia-Ying Lee | 2018-10-23 |
| 10043754 | Semiconductor device having air gap structures and method of fabricating thereof | Chih-Yuan Ting | 2018-08-07 |
| 9991200 | Air gap structure and method | Chih-Yuan Ting | 2018-06-05 |
| 9966309 | Contact plug without seam hole and methods of forming the same | Chih-Yuan Ting | 2018-05-08 |
| 9929094 | Semiconductor device having air gap structures and method of fabricating thereof | Chih-Yuan Ting | 2018-03-27 |
| 9892960 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Chih-Yuan Ting, Minghsing Tsai | 2018-02-13 |
| 9887126 | Structure of dual damascene structures having via hole and trench | Tai-Yen Peng | 2018-02-06 |
| 9865500 | Method of fine line space resolution lithography for integrated circuit features using double patterning technology | Chia-Ying Lee | 2018-01-09 |