Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163698 | Interconnect structure and manufacturing method thereof | Ming-Han Lee | 2018-12-25 |
| 10164018 | Semiconductor interconnect structure having graphene-capped metal interconnects | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue | 2018-12-25 |
| 9984975 | Barrier structure for copper interconnect | Yu-Hung Lin, Yu-Min Chang, You-Hua Chou, Chih-Wei Chang | 2018-05-29 |
| 9966304 | Method for forming interconnect structure | Yu-Hung Lin, Hsin-Chen Tsai, Yao-Hsiang Liang, Yu-Min Chang, Shih-Chi Lin | 2018-05-08 |
| 9966339 | Barrier structure for copper interconnect | Yu-Hung Lin, Yu-Min Chang, You-Hua Chou, Chih-Wei Chang, Sheng-Hsuan Lin | 2018-05-08 |
| 9947583 | Method of semiconductor integrated circuit fabrication | Chao-Hsien Peng, Hsien-Chang Wu, Hsiang-Huan Lee | 2018-04-17 |