Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966304 | Method for forming interconnect structure | Yu-Hung Lin, Ching-Fu Yeh, Yao-Hsiang Liang, Yu-Min Chang, Shih-Chi Lin | 2018-05-08 |
HT
Hsin-Chen Tsai
Overall (2018): #393,866 of 503,207Top 80%
1
Patents 2018