Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9966304 | Method for forming interconnect structure | Yu-Hung Lin, Ching-Fu Yeh, Hsin-Chen Tsai, Yao-Hsiang Liang, Yu-Min Chang | 2018-05-08 |
SL
Shih-Chi Lin
Overall (2018): #240,282 of 503,207Top 50%
1
Patents 2018