Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163786 | Method of forming metal interconnection | Ming-Han Lee, Shau-Lin Shue, Tz-Jun Kuo | 2018-12-25 |
| 10164018 | Semiconductor interconnect structure having graphene-capped metal interconnects | Ching-Fu Yeh, Ming-Han Lee, Shau-Lin Shue | 2018-12-25 |
| 10141260 | Interconnection structure and method for forming the same | Yu-Chen Chan, Ming-Han Lee | 2018-11-27 |
| 9972529 | Method of forming metal interconnection | Ming-Han Lee, Shau-Lin Shue, Tz-Jun Kuo | 2018-05-15 |