Issued Patents 2018
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121653 | Bottom-up PEALD proces | Lin-Jung Wu, Su-Horng Lin | 2018-11-06 |
| 10113233 | Multi-zone temperature control for semiconductor wafer | Chun-Lin Chang, Hsin-Hsien Wu, Zin-Chang Wei, Chyi Shyuan Chern, Jun-Lin Yeh +4 more | 2018-10-30 |
| 10090207 | Multi-point chemical mechanical polishing end point detection system and method of using | Jiann Lih Wu, Jeng-Jyi Hwang, Soon-Kang Huang | 2018-10-02 |
| 10066127 | Composition for chemical mechanical polishing and method for reducing chemical mechanical polishing surface defects | An-Dih Yu | 2018-09-04 |
| 10065288 | Chemical mechanical polishing (CMP) platform for local profile control | Jiann Lih Wu, James Jeng-Jyi Hwang | 2018-09-04 |
| 10035929 | pH-adjuster free chemical mechanical planarization slurry | Shu-Hao Huang, Horng-Huei Tseng, Jeng-Jyi Hwang | 2018-07-31 |
| 10020209 | Fine temperature controllable wafer heating system | Ying-Hsueh Chang Chien | 2018-07-10 |
| 10011918 | Apparatus and process of electro-chemical plating | Ying-Hsueh Changchien, Yu-Ming Lee | 2018-07-03 |
| 9958424 | Method of identifying airborne molecular contamination source | Tzu-Sou Chuang, Jeng-Jyi Hwang, Cheng-Lung Chou, Chin-Hsiang Lin | 2018-05-01 |
| 9929045 | Defect inspection and repairing method and associated system and non-transitory computer readable medium | Nai-Han Cheng | 2018-03-27 |
| 9892954 | Wafer processing system using multi-zone chuck | Nai-Han Cheng, You-Hua Chou, Kuo-Sheng Chuang, Chin-Hsiang Lin | 2018-02-13 |
| 9892931 | Semiconductor manufacturing apparatus and method thereof | Nai-Han Cheng | 2018-02-13 |
| 9869018 | Solid precursor delivery method using liquid solvent for thin film deposition | Chung-Chieh Lee, Lin-Jung Wu | 2018-01-16 |
| 9864270 | Pellicle and method for manufacturing the same | Jeng-Shin Ma, Tsiao-Chen Wu, Chyi Shyuan Chern, Chih-Cheng Lin, Yun-Yue Lin | 2018-01-09 |
| 9865429 | Ion implantation with charge and direction control | Chih-Hong Hwang, Chun-Lin Chang, Nai-Han Cheng, Chin-Hsiang Lin | 2018-01-09 |
| 9859139 | 3D IC bump height metrology APC | Nai-Han Cheng | 2018-01-02 |