Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090207 | Multi-point chemical mechanical polishing end point detection system and method of using | Jeng-Jyi Hwang, Soon-Kang Huang, Chi-Ming Yang | 2018-10-02 |
| 10065288 | Chemical mechanical polishing (CMP) platform for local profile control | Chi-Ming Yang, James Jeng-Jyi Hwang | 2018-09-04 |