Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163843 | Semiconductor device structure and manufacturing method | Li-Guo Lee, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-12-25 |
| 10090267 | Bump structure and method for forming the same | Li-Guo Lee, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-10-02 |
| 9997482 | Solder stud structure | Li-Guo Lee, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2018-06-12 |