Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2018-12-25 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng, Shyue-Ter Leu +2 more | 2018-01-16 |