Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2018-12-25 |
| 10157825 | Dummy metal with zigzagged edges | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-18 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2018-11-27 |
| 10109607 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su | 2018-10-23 |
| 10062648 | Semiconductor package and method of forming the same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2018-08-28 |
| 10032651 | Package structures and method of forming the same | Hsien-Wei Chen, Li-Han Hsu, Lai Wei Chih | 2018-07-24 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2018-06-12 |
| 9929112 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2018-03-27 |