Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163839 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-12-25 |
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2018-07-31 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chen-Cheng Kuo, Chih-Hua Chen, Chen-Shien Chen, Yao-Chun Chuang | 2018-01-30 |