HT

Hua-Wei Tseng

TSMC: 1 patents #1,476 of 2,904Top 55%
📍 New Taipei, TW: #629 of 1,960 inventorsTop 35%
Overall (2018): #392,689 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10037973 Method for manufacturing semiconductor package structure Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen, Ming Hung Tseng +1 more 2018-07-31