Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163844 | Semiconductor device having conductive bumps of varying heights | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2018-12-25 |
| 10163842 | Semiconductor structure and manufacturing method thereof | Chien-Hung Kuo, Chin-Yu Ku, Yuh-Sen Chang, Hon-Lin Huang, Ching-Hui Chen +1 more | 2018-12-25 |
| 10157874 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang | 2018-12-18 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Yao-Chun Chuang | 2018-08-21 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen | 2018-04-03 |
| 9871013 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang | 2018-01-16 |