Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157874 | Contact area design for solder bonding | Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu | 2018-12-18 |
| 10008459 | Structures having a tapering curved profile and methods of making same | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2018-06-26 |
| 9935024 | Method for forming semiconductor structure | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai | 2018-04-03 |
| 9871013 | Contact area design for solder bonding | Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu | 2018-01-16 |