Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-12-18 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2018-12-18 |
| 10157874 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2018-12-18 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-27 |
| 9898645 | Fingerprint sensor device and method | Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-20 |
| 9871013 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2018-01-16 |