TK

Ting-Ting Kuo

TSMC: 1 patents #1,476 of 2,904Top 55%
Overall (2018): #212,034 of 503,207Top 45%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10157808 Package structure and method of forming package structure Chih-Hsuan Tai, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu +1 more 2018-12-18