Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163844 | Semiconductor device having conductive bumps of varying heights | Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2018-12-25 |
| 10153243 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-12-11 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-10-30 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Yu-Wei Lin, Chen-Shien Chen, Guan-Yu Chen, Tin-Hao Kuo | 2018-08-07 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2018-04-24 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-04-24 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen, Sheng-Yu Wu | 2018-04-03 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-03-13 |
| 9893107 | Semiconductor device with reduced leakage current and fabricating method thereof | Chia-Yu Wei, Hsin-Chi Chen, Ssu-Chiang Weng, Yung-Lung Hsu, Chin-Hsun Hsiao | 2018-02-13 |