Issued Patents 2018
Showing 51–65 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-02-27 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Hung-Jui Kuo, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2018-02-20 |
| 9893044 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2018-02-13 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chih-Wei Lin, Hui-Min Huang, Chun-Cheng Lin, Ming-Da Cheng | 2018-02-13 |
| 9888527 | Systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Wei-Yu Chen, Ai-Tee Ang, Ming-Da Cheng | 2018-02-06 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-02-06 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung | 2018-01-30 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2018-01-30 |
| 9875388 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai | 2018-01-23 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-01-16 |
| 9865574 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-01-09 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin +3 more | 2018-01-02 |
| 9859206 | Photoactive compound gradient photoresist | Chen-Hua Yu, Hung-Jui Kuo | 2018-01-02 |