Issued Patents 2018
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090254 | Wafer alignment methods in die sawing process | Yu-Hsiang Hu, Ming-Da Cheng | 2018-10-02 |
| 10062659 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Wen-Hsiung Lu, Ming-Da Cheng, Mirng-Ji Lii | 2018-08-28 |
| 10062654 | Semicondcutor structure and semiconductor manufacturing process thereof | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2018-08-28 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Yu-Min Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2018-08-14 |
| 10050000 | Bump-on-trace structures with high assembly yield | Chih-Fan Huang, Chen-Shien Chen, Ming-Da Cheng, Tin-Hao Kuo, Yi-Teh Chou | 2018-08-14 |
| 10049986 | Package structures and methods of making the same | Zi-Jheng Liu, Hung-Jui Kuo, Yu-Hsiang Hu | 2018-08-14 |
| 10049889 | Method of fabricating package structures | Yu-Hsiang Hu, Hung-Jui Kou, Sih-Hao Liao | 2018-08-14 |
| 10043778 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2018-08-07 |
| 10032734 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chen-Hua Yu | 2018-07-24 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng, Meng-Tse Chen +2 more | 2018-07-10 |
| 10015888 | Interconnect joint protective layer apparatus and method | Cheng-Ting Chen, Hsuan-Ting Kuo, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng | 2018-07-03 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-07-03 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Yen-Chang Hu, Chih-Wei Lin, Ming-Da Cheng, Chen-Shien Chen | 2018-06-05 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2018-05-22 |
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Zheng-Yi Lim, Ming-Che Ho | 2018-04-24 |
| 9941221 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng | 2018-04-10 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen +1 more | 2018-04-03 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-04-03 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2018-04-03 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2018-04-03 |
| 9935047 | Bonding structures and methods forming the same | Mirng-Ji Lii, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho +3 more | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2018-03-27 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911724 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai, Chen-Hua Yu | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |