Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10015888 | Interconnect joint protective layer apparatus and method | Cheng-Ting Chen, Hsien-Wei Chen, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2018-07-03 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng +1 more | 2018-04-03 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng +2 more | 2018-01-30 |