Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157884 | 3D die stacking structure with fine pitches | Chen-Hua Yu, Chen-Shien Chen | 2018-12-18 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2018-06-05 |