Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929071 | Dicing in wafer level package | An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2018-03-27 |
CC
Chia-Shen Cheng
Overall (2018): #463,352 of 503,207Top 95%
1
Patents 2018