Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2018-04-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953891 | Method of forming post-passivation interconnect structure | Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2018-04-24 |