Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109618 | Bonding structure between semiconductor device package | Ming-Da Cheng, Chung-Shi Liu | 2018-10-23 |
| 9879823 | Reclosable strap assembly | Mark Lee Oberpriller, Robert Bruffey, Marcus Charles Phillips | 2018-01-30 |