Issued Patents 2018
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2018-01-30 |
| 9876069 | High-voltage semiconductor device and method for manufacturing the same | Pao-Hao Chiu, Keng-Yu Lin | 2018-01-23 |
| 9865574 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-09 |
| 9866060 | Apparatus for performing hybrid power control in an electronic device to allow charging using any of high power adaptors corresponding to different voltages | Nien-Hui Kung, Yen-Hsun Hsu | 2018-01-09 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Wei-Hung Lin +3 more | 2018-01-02 |