Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2018-10-23 |
| 10090243 | Inductor for semiconductor integrated circuit | Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu | 2018-10-02 |