Issued Patents 2018
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020271 | Calibration kits for RF passive devices | Jie Chen, Hao-Yi Tsai, Hung-Yi Kuo | 2018-07-10 |
| 10015888 | Interconnect joint protective layer apparatus and method | Cheng-Ting Chen, Hsuan-Ting Kuo, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2018-07-03 |
| 10008460 | Semiconductor package and method of forming the same | An-Jhih Su | 2018-06-26 |
| 10008413 | Wafer level dicing method | Ying-Ju Chen | 2018-06-26 |
| 9997465 | Semiconductor package structure | Jie Chen | 2018-06-12 |
| 9997483 | Ball amount process in the manufacturing of integrated circuit | Tsung-Yuan Yu, Wen-Hsiung Lu, Ming-Da Cheng | 2018-06-12 |
| 9997480 | Method of forming a semiconductor device including strain reduced structure | Ying-Ju Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang | 2018-06-12 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2018-06-12 |
| 9991247 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Ying-Ju Chen | 2018-06-05 |
| 9991207 | Test key strcutures, integrated circuit packages and methods of forming the same | Shao-Yun Chen, Li-Hsien Huang | 2018-06-05 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Shih-Peng Tai | 2018-05-29 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |
| 9984965 | Inductor system and method | Hao-Yi Tsai, Hung-Yi Kuo, Tsung-Yuan Yu | 2018-05-29 |
| 9978704 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Ying-Ju Chen, Shih-Wei Liang | 2018-05-22 |
| 9972581 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2018-05-15 |
| 9953963 | Integrated circuit process having alignment marks for underfill | An-Jhih Su, Wei-Yu Chen | 2018-04-24 |
| 9947630 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2018-04-17 |
| 9947626 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2018-04-17 |
| 9941248 | Package structures, pop devices and methods of forming the same | Tien-Chung Yang, An-Jhih Su, Jo-Mei Wang, Wei-Yu Chen | 2018-04-10 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2018-04-03 |
| 9935084 | Devices and methods of packaging semiconductor devices | Jie Chen | 2018-04-03 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2018-03-27 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2018-03-27 |
| 9929112 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2018-03-27 |